Electronic module, methods of manufacturing and driving the same, and electronic instrument

ABSTRACT

An electronic module includes an EL section; a first substrate on which the EL section is formed; a second substrate attached to the first substrate; an integrated circuit chip mounted on the second substrate; a plurality of first power supply interconnects formed on the first substrate, extending through a pair of regions located on both sides of the EL section; and a plurality of second power supply interconnects formed on the second substrate, extending through a pair of regions located on both sides of the integrated circuit chip.

This is a Divisional of application Ser. No. 10/649,902, filed Aug. 28,2003. The entire disclosure of the prior application is herebyincorporated by reference herein in its entirety.

Japanese Patent Application No. 2002-253544 filed on Aug. 30, 2002,Japanese Patent Application No. 2002-262923 filed on Sep. 9, 2002,Japanese Patent Application No. 2002-266832 filed on Sep. 12, 2002, andJapanese Patent Application No. 2003-275430 filed on Jul. 16, 2003, arehereby incorporated by reference in their entirety.

BACKGROUND OF THE INVENTION

The present invention relates to an electronic module, methods ofmanufacturing and driving the same, and an electronic instrument.

Recently, development of electronic modules using electroluminescence(hereinafter may be referred to as “EL”) has progressed. An electronicmodule such as an EL module includes an electronic substrate (EL panel,for example) and an interconnect substrate (flexible substrate, forexample). The EL panel is driven by using a semiconductor chip (driverIC, for example) mounted on the interconnect substrate in the samemanner as a liquid crystal device (liquid crystal panel, for example).However, since the operation principle of the EL panel differs from thatof the liquid crystal panel, an interconnect pattern formed on theinterconnect substrate for driving the EL panel needs to be arrangedcorresponding to the structure of the EL panel. Moreover, the electronicsubstrate and the interconnect substrate have a number of terminalswhich are electrically connected with each other. Conventionally, if theterminal arrangement of the electronic substrate is changed, theterminal arrangement of the interconnect substrate must be changed.Furthermore, in the case where several power supplies are required todrive the electronic substrate, the power supplies are provided from theoutside of the electronic module. Therefore, it is difficult toadequately cope with changes in electronic substrate.

BRIEF SUMMARY OF THE INVENTION

An electronic module according to an aspect of the present inventioncomprises:

an EL section;

a first substrate on which the EL section is formed;

a second substrate attached to the first substrate;

an integrated circuit chip mounted on the second substrate; and

a plurality of power supply interconnects for allowing current to flowthrough the EL section,

wherein the power supply interconnects include: a plurality of firstpower supply interconnects formed on the first substrate, extendingthrough a pair of regions located on both sides of the EL section; and aplurality of second power supply interconnects formed on the secondsubstrate, extending through a pair of regions located on both sides ofthe integrated circuit chip, the first and second power supplyinterconnects being electrically connected.

A method of manufacturing an electronic module according to anotheraspect of the present invention comprises:

fixing a first substrate, on which an EL section is formed, with asecond substrate on which an integrated circuit chip is mounted,

wherein the first substrate includes a plurality of first power supplyinterconnects which are formed extending through a pair of regionslocated on both sides of the EL section,

wherein the second substrate includes a plurality of second power supplyinterconnects which are formed extending through a pair of regionslocated on both sides of the integrated circuit chip, and

wherein the first and second power supply interconnects are electricallyconnected in the step of fixing the first and second substrate.

An electronic module according to a further aspect of the presentinvention comprises:

an electronic substrate including a plurality of first terminals;

an interconnect substrate on which an interconnect pattern is formed,the interconnect pattern including a plurality of second terminalselectrically connected with the first terminals of the electronicsubstrate, at least two first interconnects extending from at least twoof the second terminals, and at least two second interconnects formed ina state to be electrically insulated from the first interconnects; and

an electrical connection section which electrically connects at leastone of the first interconnects with at least one of the secondinterconnects.

A method of manufacturing an electronic module according to a stillfurther aspect of the present invention comprises:

electrically connecting a plurality of first terminals of an electronicsubstrate with a plurality of second terminals of an interconnectsubstrate; and

electrically connecting at least one of two or more first interconnectsextending from two or more of the second terminals with at least one oftwo or more second interconnects formed in a state to be electricallyinsulated from the first interconnects, by means of an electricalconnection section.

An electronic module according to an even further aspect of the presentinvention comprises:

an electronic substrate, and

an interconnect substrate which is attached to the electronic substrateand on which an integrated circuit chip is mounted,

wherein the interconnect substrate includes an input terminal, and atleast one amplifier circuit which generates a plurality of differentamplified power supplies by amplifying an external power supply input tothe input terminal.

A method of driving the electronic module according to a yet furtheraspect of the present invention comprises:

inputting an external power supply to an input terminal formed on aninterconnect substrate on which an integrated circuit chip is mounted;

generating a plurality of different amplified power supplies byamplifying the external power supply by using one or more amplifiercircuits formed on the interconnect substrate; and

driving an electronic substrate electrically connected with theinterconnect substrate by using the plurality of different amplifiedpower supplies.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 illustrates an electronic module according to a first embodimentof the present invention.

FIG. 2 is a plan view illustrating a first substrate of the electronicmodule according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a first substrate of anelectronic module according to the first embodiment of the presentinvention.

FIG. 4 is a plan view showing a second substrate of the electronicmodule according to the first embodiment of the present invention.

FIG. 5 is a circuit diagram of the electronic module according to thefirst embodiment of the present invention.

FIG. 6 illustrates an electronic module according to a second embodimentof the present invention.

FIG. 7 is a plan view showing an electronic substrate of the electronicmodule according to the second embodiment of the present invention.

FIG. 8 is a cross-sectional view showing the electronic substrate of theelectronic module according to the second embodiment of the presentinvention.

FIG. 9 illustrates an electrical connection section and its neighboringconfiguration of the electronic module according to the secondembodiment of the present invention.

FIG. 10 illustrates a manufacturing method of an interconnect substrateof the electronic module according to the second embodiment of thepresent invention.

FIG. 11A and FIG. 11B illustrate connecting configurations of first andsecond interconnects in the electronic module according to the secondembodiment of the present invention.

FIG. 12 is a circuit diagram of the electronic module according to thesecond embodiment of the present invention.

FIG. 13 illustrates an electronic module according to a third embodimentof the present invention.

FIG. 14 is a plan view showing an electronic substrate of the electronicmodule according to the third embodiment of the present invention.

FIG. 15 is a cross-sectional view illustrating the electronic substrateof the electronic module according to the third embodiment of thepresent invention.

FIG. 16 illustrates a modification of interconnect substrate of theelectronic module according to the third embodiment of the presentinvention.

FIG. 17 is a circuit diagram of the electronic module according to thethird embodiment of the present invention.

FIG. 18 illustrates an example of an electronic instrument according toan embodiment of the present invention.

FIG. 19 illustrates another example of an electronic instrumentaccording to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENT

Embodiments of the present invention may provide an electronic modulehaving interconnects disposed corresponding to the EL structure, amethod of manufacturing the same, and an electronic instrument, mayprovide an electronic module capable of dealing with a change interminal arrangement of an electronic substrate, a method ofmanufacturing the same, and an electronic instrument, or may provide anelectronic module which can be driven by inputting only a few types ofpower supplies, a method of driving the same, and an electronicinstrument.

(1) An electronic module according to an embodiment of the presentinvention comprises: an EL section;

a first substrate on which the EL section is formed;

a second substrate attached to the first substrate;

an integrated circuit chip mounted on the second substrate; and

a plurality of power supply interconnects for allowing current to flowthrough the EL section,

wherein the power supply interconnects include: a plurality of firstpower supply interconnects formed on the first substrate, extendingthrough a pair of regions located on both sides of the EL section; and aplurality of second power supply interconnects formed on the secondsubstrate, extending through a pair of regions located on both sides ofthe integrated circuit chip, the first and second power supplyinterconnects being electrically connected.

According to this electronic module, the power supply interconnects areformed extending through a pair of regions located on both sides of theEL section and the integrated circuit chip. Therefore, current can beallowed to equivalently flow on both sides of the EL section due toequivalence of impedance of the power supply interconnects on the bothsides, lowering the impedance to diminish noise. section, and

the signal interconnects may be formed in a region interposing between afirst region in which one part of the power supply interconnects areformed and a second region in which the other part of the power supplyinterconnects are formed.

(3) In this electronic module, width of each of the signal interconnectsmay be narrower than width of each of the power supply interconnects.

(4) This electronic module may further comprise:

a pair of scanning drivers disposed on both sides of the EL section,respectively, on the first substrate; and

a plurality of control interconnects for inputting a control signal fromthe integrated circuit chip to each of the scanning drivers, and

the control interconnects may be formed in a pair of regions which arelocated on both sides of a region in which the signal interconnects areformed and interpose between the first region and the second region.

(5) This electronic module may further comprise a plurality of connectorterminals formed on an end portion of the second substrate except aportion to which the first substrate is attached, and

width of each of the connector terminals may be formed to be wider thanwidth of each of the power supply interconnects.

(6) An electronic instrument according to another embodiment of thepresent invention comprises the above electronic module.

(7) A method of manufacturing an electronic module according to afurther embodiment of the present invention comprises:

fixing a first substrate, on which an EL section is formed, with asecond substrate on which an integrated circuit chip is mounted,

wherein the first substrate includes a plurality of first power supplyinterconnects which are formed extending through a pair of regionslocated on both sides of the EL section,

wherein the second substrate includes a plurality of second power supplyinterconnects which are formed extending through a pair of regionslocated on both sides of the integrated circuit chip, and

wherein the first and second power supply interconnects are electricallyconnected in the step of fixing the first and second substrate.

According to this method of manufacturing an electronic module, thepower supply interconnects are formed extending through a pair ofregions located on both sides of the EL section and the integratedcircuit chip. Therefore, current can be allowed to equivalently flow onboth sides of the EL section due to equivalence of impedance of thepower supply interconnest on the both sides, lowering the impedance todiminish noise.

(8) An electronic module according to a still further embodiment of thepresent invention comprises:

an electronic substrate including a plurality of first terminals;

an interconnect substrate on which an interconnect pattern is formed,the interconnect pattern including a plurality of second terminalselectrically connected with the first terminals of the electronicsubstrate, at least two first interconnects extending from at least twoof the second terminals, and at least two second interconnects formed ina state to be electrically insulated from the first interconnects; and

an electrical connection section which electrically connects at leastone of the first interconnects with at least one of the secondinterconnects.

According to this electronic module, it is possible to change thetransmission paths of the interconnect pattern depending on which of thefirst interconnects and the second interconnects are electricallyconnected by the electrical connection section. Therefore, even if thearrangement sequence of the first terminals of the electronic substrateis changed, it is possible to deal with the change by merely changingthe transmission paths by using the electrical connection section.

(9) This electronic module may further comprise an integrated circuitchip mounted on the interconnect substrate, and

the second interconnects may be electrically connected with theintegrated circuit chip.

(10) In this electronic module, the electrical connection section may beprovided at a position closer to the electronic substrate than theintegrated circuit chip.

(11) In this electronic module, the electrical connection section may beprovided in each of a pair of regions respectively located closer toboth ends of the interconnect substrate than a center of theinterconnect substrate in a widthwise direction.

(12) An electronic instrument according to a still further embodiment ofthe present invention comprises the electronic module as described in(8) to (11).

(13) A method of manufacturing an electronic module according to a stillfurther embodiment of the present invention comprises:

electrically connecting a plurality of first terminals of an electronicsubstrate with a plurality of second terminals of an interconnectsubstrate; and

electrically connecting at least one of two or more first interconnectsextending from two or more of the second terminals with at least one oftwo or more second interconnects formed in a state to be electricallyinsulated from the first interconnects, by means of an electricalconnection section.

According to this method of manufacturing an electronic module, it ispossible to change the transmission paths of the interconnect patterndepending on which of the first interconnects and the secondinterconnects are electrically connected by the electrical connectionsection. Therefore, even if the arrangement sequence of the firstterminals in the electronic substrate is changed, it is possible to dealwith the change by merely changing the transmission paths by using theelectrical connection section.

(14) An electronic module according to a still further embodiment of thepresent invention comprises:

an electronic substrate; and

an interconnect substrate which is attached to the electronic substrateand on which an integrated circuit chip is mounted,

wherein the interconnect substrate includes an input terminal and one ormore amplifier circuits, each of the amplifier circuits generating aplurality of different amplified power supplies by amplifying anexternal power supply input to the input terminal.

According to this electronic module, since the plurality of differentamplified power supplies are generated by amplifying the external powersupply, the electronic module can be driven by a few types of externalpower supplies (single power supply, for example).

(15) In this electronic module,

the integrated circuit chip may be driven by the external power supply,and

the electronic substrate may be driven by the amplified power supplies.

(16) In this electronic module, the amplifier circuit may be formed in aregion between the integrated circuit chip and the input terminal.

(17) In this electronic module,

the integrated circuit chip may be mounted at a center of theinterconnect substrate in a widthwise direction, and

a pair of the amplifier circuits may be respectively formed on both endportions of the interconnect substrate in the widthwise direction.

(18) In this electronic module, the interconnect substrate may include:

signal interconnects which extend from the integrated circuit chiptoward the electronic substrate; and

power supply interconnects which extend from the pair of amplifiercircuits toward the electronic substrate, and

the power supply interconnects may be formed to be wider than the signalinterconnects.

(19) In this electronic module, one of the amplifier circuits mayinclude a first circuit and a second circuit, the first circuit beingformed on the integrated circuit chip, and a second circuit beingprovided separately from the integrated circuit chip.

(20) In this electronic module, the second circuit may include acapacitor.

(21) In this electronic module, the second circuit may include aninductor.

(22) An electronic instrument according to an even further embodiment ofthe present invention comprises the electronic module as described in(14) to (21).

(23) A method of driving an electronic module according to a yet furtherembodiment of the present invention comprises:

inputting an external power supply to an input terminal formed on aninterconnect substrate on which an integrated circuit chip is mounted;

generating a plurality of different amplified power supplies byamplifying the external power supply by using one or more amplifiercircuits formed on the interconnect substrate; and

driving an electronic substrate electrically connected with theinterconnect substrate by using the plurality of different amplifiedpower supplies.

According to this method of driving an electronic module, since theplurality of different amplified power supplies are generated byamplifying the external power supply, the electronic module can bedriven by a few types of external power supplies (single power supply,for example).

In the following sections, embodiments of the present invention aredescribed in more detail referring to accompanying drawings.

First Embodiment

FIG. 1 illustrates an electronic module according to a first embodimentof the present invention. The electronic module has a first substrate10. FIG. 2 is a plan view of the first substrate 10, and FIG. 3 is across-sectional view of the first substrate 10.

The first substrate 10 may be a glass substrate, a plastic substrate, ora silicon substrate. As shown in FIG. 3, in the case where light isextracted from the first substrate 10, a light-transmitting substrate isused as the first substrate 10. The first substrate 10 has an EL section12 such as an organic EL section. The EL section 12 emits light byutilizing an electroluminescence phenomenon. The EL section 12 may be acarrier injection type. The EL section 12 is driven by electric current.In more detail, current flows through a luminescent material (organicmaterial, for example) 14 (see FIG. 3). The first substrate 10 havingthe EL section 12 may be an EL panel.

As shown in FIG. 2, a plurality of first power supply interconnects 16,18, 20, and 22 are formed on the first substrate 10. The first powersupply interconnects 16, 18, 20, and 22 are formed extending through apair of regions located on both sides of the EL section 12. Each of thefirst power supply interconnects 16, 18, and 20 is an anode interconnectfor allowing current to flow through the EL section 12. Each of thefirst power supply interconnects 16, 18, and 20 is formed to have adifferent width, and is suitable for allowing a different value ofcurrent to flow corresponding to the difference in luminous efficiencydepending on the color (RGB) of the luminescent material 14. The firstpower supply interconnect 22 is a cathode interconnect. The first powersupply interconnect 22 is disposed on the outer side of the first powersupply interconnects 16, 18, and 20. The first power supply interconnect22 is formed in the shape of the letter “C” in order to avoid the edgeon which the second substrate 50 is attached.

The first power supply interconnects (anode interconnects) 16, 18, and20 are connected with a plurality of anodes 24 (see FIG. 3). The firstpower supply interconnect (cathode interconnect) 22 is connected with acathode 26 (see FIG. 3). The cathode 26 is formed to face the anodes 24.The luminescent material 14 is provided between each of the anodes 24and the cathode 26. A hole transport layer may be formed between theanodes 24 and the luminescent material 14, and an electron transportlayer may be formed between the cathode 26 and the luminescent material14. Each of the first power supply interconnects 16, 18, 20, and 22 isdivided into a plurality of interconnects, each having a terminal 28.

The first substrate 10 has a plurality of first signal interconnects 30for inputting a drive signal to the EL section 12. The first signalinterconnects 30 are formed in a region interposing between first andsecond regions in which one part of and the other part of the firstpower supply interconnects 16, 18, 20, and 22 are formed. Each of thefirst signal interconnects 30 is formed to be narrower than the firstpower supply interconnects 16, 18, 20, and 22. Terminals 32 of the firstsignal interconnects 30 are formed to be narrower than the terminals 28of the first power supply interconnects.

A pair of scanning drivers 34 is formed on both sides of the EL section12, respectively, on the first substrate 10. The scanning driver 34 maybe a chip component or a thin film circuit (circuit including TFTs)formed on the first substrate 10. Each of the scanning drivers 34 isdisposed between the EL section 12 and each of the first and secondregions in which one part of and the other part of the first powersupply interconnects 16, 18, 20, and 22 are formed. Each of the pair ofscanning drivers 34 is connected with a plurality of first controlinterconnects 36 for inputting a control signal. The first controlinterconnects 36 are formed in a pair of regions which are located onboth sides of a region in which the first signal interconnects 30 areformed and interpose between the first and second regions in which onepart of and the other part of the first power supply interconnects 16,18, 20, and 22 are formed. Terminals 38 of the first controlinterconnects 36 may be formed to have the same width as the terminals28 of the first power supply interconnects, and formed to be wider thanthe terminals 32 of the first signal interconnects 30.

In the present embodiment, the terminals 28, 32, and 38 are arranged toextend toward one side of the first substrate 10. The first substrate 10has a first positioning mark 40. The first and second substrates 10 and50 can be positioned by aligning the first positioning mark 40 with asecond positioning mark 70 described later (see FIG. 4). A sealingsection 42 is optionally provided to the first substrate 10. The sealingsection 42 is provided to cover the cathode 26 to prevent entrance ofmoisture or oxygen. The sealing section 42 may be formed of a glasssubstrate or a plastic substrate if light transmittance is required. Thesealing section 42 may be formed of a metal or silicon if lighttransmittance is not required.

As shown in FIG. 1, an electronic module has a second substrate 50. Thesecond substrate 50 may be a flexible substrate. The second substrate 50is attached to the first substrate 10. FIG. 4 is a view illustrating thesecond substrate and a method of manufacturing the same. An integratedcircuit chip 52 is mounted on the second substrate 50. A signal driverhaving a function of generating a signal to be supplied to the ELsection 12 may be formed in the integrated circuit chip 52. Theintegrated circuit chip 52 may be bonded face down or electricallyconnected by Tape automated bonding (TAB).

A plurality of second power supply interconnects 54 are formed on thesecond substrate 50. The second power supply interconnects 54 are formedextending through a pair of regions located on both sides of theintegrated circuit chip 52. If the second power supply interconnects 54are formed extending through only one side of the pair of regionslocated on both sides of the integrated circuit chip 52, one group ofthe second power supply interconnects 54 becomes longer than the othergroup of the second power supply interconnects 54. In the presentembodiment, since the difference in length between the second powersupply interconnects 54 is small, current can be allowed to flowuniformly. The second power supply interconnects 54 are electricallyconnected with the first power supply interconnects 16, 18, 20, and 22.In more detail, terminals 56 of the second power supply interconnects 54are electrically connected with the terminals 28 of the first powersupply interconnects. The electrical connection may be established byusing an anisotropic conductive material (anisotropic conductive film oranisotropic conductive paste, for example). The electrically connectedfirst and second power supply interconnects make up a power supplyinterconnect for allowing current to flow through the EL section 12.

The second substrate 50 has a plurality of second signal interconnects58 for inputting a drive signal from the integrated circuit chip 52 tothe EL section 12. The second signal interconnects 58 are formed in aregion interposing between first and second regions in which the secondpower supply interconnects 54 are formed. The second signalinterconnects 58 are formed to be narrower than the second power supplyinterconnects 54. Terminals 60 of the second signal interconnects 58 areformed to be narrower than the terminals 56 of the second power supplyinterconnects 54. The second signal interconnects 58 are electricallyconnected with the first signal interconnects 30. In more detail, theterminals 60 of the second signal interconnects 58 are electricallyconnected with the terminals 32 of the first signal interconnects 30.The electrical connection may be the same as that of the terminals 28and 56. The electrically connected first and second signal interconnectsmake up a signal interconnect. The signal interconnect is used to inputa drive signal from the integrated circuit chip 52 to the EL section 12.

A plurality of second control interconnects 62 are formed on the secondsubstrate 50. The second control interconnects 62 are connected with theintegrated circuit chip 52 which outputs a control signal (clock signal,for exmple). The second control interconnects 62 are formed in a pair ofregions which are located on both sides of a region in which the secondsignal interconnects 58 are formed and interpose between the first andsecond regions in which the second power supply interconnects 54 areformed. A synchronized clock signal may be output to each pair ofregions which are located on both sides of the region in which thesecond signal interconnects 58 are formed. Terminals 64 of the secondcontrol interconnects 62 may be formed to have the same width as theterminals 56 of the second power supply interconnects 54, and to bewider than the terminals 60 of the second signal interconnects 58. Thesecond control interconnects 62 are electrically connected with thefirst control interconnects 36. In more detail, the terminals 64 of thesecond control interconnects 62 are electrically connected with theterminals 38 of the first control interconnects 36. The electricalconnection may be the same as that of the terminals 28 and 56. Theelectrically connected first and second control interconnects make up acontrol interconnect. The control interconnect is used to input acontrol signal (clock signal, for example) from the integrated circuitchip 52 to the scanning driver 34.

A plurality of input interconnects 66 are formed on the second substrate50. The input interconnects 66 are connected with the integrated circuitchip 52, and extend from the integrated circuit chip 52 in the oppositedirection to where the second signal interconnects 58 extend. The inputinterconnects 66 are used to input a data signal (digital signal, forexample), a chip select signal, or source power to the integratedcircuit chip 52.

Connector terminals 68 are formed on the second substrate 50. Theconnector terminals 68 are formed at an end portion except a portion towhich the first substrate 10 is attached. The connector terminals 68 areformed to be wider than the power supply interconnects (first powersupply interconnects 16, 18, 20, and 22 and second power supplyinterconnects 54). The connector terminals 68 are end sections of thesecond power supply interconnects 54 and the input interconnects 66. Theconnector terminals 68 are formed extending toward one side of thesecond substrate 50.

The second substrate 50 has a second positioning mark 70. The first andsecond substrates 10 and 50 can be positioned by aligning the secondpositioning mark 70 with the first positioning mark 40.

The second substrate 50 may be formed by punching a tape 72 as shown bya two-dot line in FIG. 4. If holes 74 are formed in advance in thesecond substrate 50 and the tape 72 is punched based on the holes 74, anaccurate punching operation can be performed. The holes 74 can be usedto fix the second substrate 50. The second substrate 50 thus fixed maybe attached to the first substrate 10.

One or more dummy patterns 76, 78, 80, and 82 are formed on the secondsubstrate 50. Since the dummy patterns 76, 78, 80, and 82 are formed,the area of the second substrate 50 which is not covered with conductivefoil is reduced, whereby warping or deformation of the second substrate50 can be prevented. The dummy patterns 76 and 82 respectively havemarks 84 and 86. The marks 84 and 86 may be through holes formed in thedummy patterns 76 and 82, or through holes formed in the dummy patterns76 and 82 and the second substrate 50, or through holes formed in aresin layer (resist layer, for example) on the dummy patterns 76 and 82.The marks 84 and 86 enable the integrated circuit chip 52 to bepositioned. The marks 84 and 86 may be used to position the closestcorners of the integrated circuit chip 52. The dummy patterns 78 and 80are formed in the shape of a stripe and have a plurality of openingsformed therein. Therefore, the dummy patterns 78 and 80 have highadhesion to a resin layer (resist layer, for example) formed thereon,whereby the resin layer is rarely removed.

A method of manufacturing the electronic module according to the presentembodiment includes fixing the first substrate 10 on which the ELsection 12 is formed with the second substrate 50 on which theintegrated circuit chip 52 is mounted. The first substrate 10 includes aplurality of first power supply interconnects 16, 18, 20, and 22 whichare formed extending through a pair of regions located on both sides ofthe EL section 12. The second substrate 50 includes a plurality ofsecond power supply interconnects 54 which are formed extending througha pair of regions located on both sides of the integrated circuit chip52. The first power supply interconnects 16, 18, 20, and 22 areelectrically connected with the second power supply interconnects 54 inthe step of fixing the first and second substrates 10 and 50.

FIG. 5 is a view illustrating circuits of the electronic moduleaccording to the present embodiment. The EL section 12 has a pluralityof scanning lines 90, a plurality of signal lines 92 which extend in thedirection intersecting the scanning lines 90, and a plurality of powersupply lines 94 which extend along the signal lines 92. The scanninglines 90 are electrically connected with a scanning driver 34 (includingshift register and level shifter, for example). The signal lines 92 areelectrically connected with a signal driver 96 of the integrated circuitchip 52. The power supply lines 94 are electrically connected with oneof the first power supply interconnects 16, 18, or 20. The luminescentmaterial 14 which becomes a pixel is provided corresponding to eachintersecting point of the scanning lines 90 and the signal lines 92.

A switching element 98 is electrically connected with the scanning lines90 corresponding to each pixel. In the case where the switching element98 is a thin film transistor (MOSFET), a gate electrode of the switchingelement 98 is electrically connected with the scanning line 90. Thesignal line 92 is electrically connected with a capacitor 100corresponding to each pixel. In more detail, the capacitor 100 iselectrically connected between the signal line 92 and the power supplyline 94 so that it can hold electric charges corresponding to an imagesignal from the signal line 92. The switching element 98 is electricallyconnected between the capacitor 100 and the signal line 92. Theswitching element 98 is controlled by a scanning signals output from thescanning line 90, and the switching element 98 controls storage ofelectric charges in the capacitor 100.

A drive element 102 is controlled by the amount of electric charges andthe presence or absence of electric charges held by the capacitor 100.In the case where the drive element 102 is a thin film transistor(MOSFET), a gate electrode of the drive element 102 is electricallyconnected with an electrode of the capacitor 100 located on the side ofthe signal line 92. The drive element 102 is electrically connectedbetween the power supply line 94 and the luminescent material 14.Specifically, the drive element 102 controls supply of current from thepower supply line 94 to the luminescent material 14.

When the switching element 98 is turned on by the scanning signal fromthe scanning line 90, electric charges are stored in the capacitor 100due to the potential difference between the signal line 92 and the powersupply line 94. The control state of the drive element 102 is determinedaccording to the electric charges. Current flows from the power supplyline 94 to the anode 24 through a channel of the drive element 102, andflows to the cathode 26 through the luminescent material 14. Theluminescent material 14 emits light corresponding to the amount ofcurrent that flows through the luminescent material 14.

Second Embodiment

FIG. 6 illustrates an electronic module (EL module or liquid crystalmodule, for example) according to a second embodiment of the presentinvention. The electronic module has an electronic substrate 110. FIG. 7is a plan view of the electronic substrate, and FIG. 8 is across-sectional view of the electronic substrate. The electronicsubstrate 110 may be a display panel (EL panel or liquid crystal panel,for example). The electronic substrate 110 has a substrate 111. Thesubstrate 111 may be a glass substrate, a plastic substrate, or asilicon substrate. As shown in FIG. 8, in the case where light isextracted from the substrate 111, a light-transmitting substrate is usedas the substrate 111.

The electronic substrate 110 has an operating section 112. The operatingsection 112 is a section in which operations for displaying an image areperformed. In the present embodiment, the operating section 112 is an EL(organic EL) section, for example. The EL section emits light byutilizing an electroluminescence phenomenon. The EL section may be of acarrier injection type. The EL section may be driven by electriccurrent. In more detail, current flows through a luminescent material(organic material, for example) (see FIG. 8).

A pair of scanning drivers 114 is disposed on both sides of theoperating section 112, respectively, on the electronic substrate 110.The scanning driver 114 may be a chip component or a thin film circuit(circuit including TFTs) formed on the substrate 111, for example.

The electronic substrate 110 has a plurality of first terminals 120,122, and 124. At least two of the first terminals 120 are electricallyconnected with a scanning driver 114 through control interconnects 126.At least two of the first terminals 122 are electrically connected withpower supply interconnects 130, 132, 134, and 136. Each of the powersupply interconnects 130, 132, and 134 is an anode interconnect forallowing current to flow through the operating section 112. Each of thepower supply interconnects 130, 132, and 134 is formed to have adifferent width, and is suitable for allowing a different value ofcurrent to flow corresponding to the difference in luminous efficiencydepending on the color (RGB) of the luminescent material 144 (see FIG.8). The power supply interconnect 136 is a cathode interconnect. Thepower supply interconnects 130, 132, 134, 136 are formed in a pair ofregions which are located on both sides of the operating section 112.The power supply interconnect (cathode interconnect) 136 is disposed onthe outer side of the power supply interconnects (anode interconnects)130, 132, and 134. The power supply interconnect 136 is formed in theshape of the letter “C” so as to avoid the edge on which an interconnectsubstrate 150 is attached. At least two of the first terminals 124 areelectrically connected with the operating section 112 through signalinterconnects 138.

Control interconnects 126 are formed in a pair of regions which arelocated on both sides of a region in which the signal interconnects 138are formed and interpose between first and second regions in which onepart and the other part of the power supply interconnects 130, 132, 134,and 136 are formed. The signal interconnects 138 are formed in a regioninterposing between a pair of regions in which the control interconnects126 are formed. The signal interconnects 138 are formed in a regioninterposing between the first and second regions in which one part andthe other part of the power supply interconnects 130, 132, 134, and 136are formed. The signal interconnects 138 are formed to be narrower thanthe control interconnects 126. The signal interconnects 138 are formedto be narrower than the power supply interconnects 130, 132, 134, and136.

First terminals 124 connected with the signal interconnects 138 areformed to be narrower than first terminals 122 and 120 connected withthe power supply interconnects 130, 132, 134, and 136 and the controlinterconnects 126. The first terminals 120 connected with the controlinterconnects 126 may be formed to have the same width as the firstterminals 122 connected with the power supply interconnects 130, 132,134, and 136. The first terminals 120 are formed to be wider than thefirst terminals 124 connected with the signal interconnects 138.

The power supply interconnects (anode interconnects) 130, 132, and 134are connected with a plurality of anodes 140 (see FIG. 8). The powersupply interconnect (cathode interconnect) 136 is connected with acathode 142 (see FIG. 8). The cathode 142 is formed to face the anodes140. A luminescent material 144 is provided between each of the anodes140 and the cathode 142. A hole transport layer may be formed betweenthe anodes 140 and the luminescent material 144, and an electrontransport layer may be formed between the cathode 142 and theluminescent material 144.

According to the present embodiment, the first terminals 120, 122, and124 are arranged to extend toward one side of the electronic substrate110. The electronic substrate 110 has a first positioning mark 146. Theelectronic substrate 110 and the interconnect substrate 150 can bepositioned by aligning the first positioning mark 146 with a secondpositioning mark 182 as described later (see FIG. 10). A sealing section148 is optionally provided to the electronic substrate 110. The sealingsection 148 is formed to cover the cathode 142 to prevent entrance ofmoisture or oxygen. The sealing section 148 may be formed of a glasssubstrate or a plastic substrate if light transmittance is required. Thesealing section 148 may be formed of a metal or silicon if lighttransmittance is not required.

An electronic module has an interconnect substrate 150. The interconnectsubstrate 150 has a substrate 151. An interconnect pattern is formed onthe interconnect substrate 150. The substrate 151 may be a flexiblesubstrate. The interconnect substrate 150 (substrate 151) is attached tothe electronic substrate 110.

An integrated circuit chip 152 is mounted on the interconnect substrate150. A signal driver 96 having a function of generating a signal to beoutput to the operating section 112 (see FIG. 12) may be formed in theintegrated circuit chip 152. The integrated circuit chip 152 may bebonded face down or electrically connected by tape automated bonding(TAB).

The interconnect substrate 150 has a plurality of second terminals 160,162, and 164. The interconnect substrate 150 has two or more firstinterconnects 166 extending from two or more of the second terminals160. The interconnect substrate 150 has two or more second interconnects168 formed so that they are electrically insulated from the firstinterconnects 166. The second interconnects 168 are electricallyconnected with the integrated circuit chip 152. A control signal (clocksignal, for example) is output from the integrated circuit chip 152 tothe second interconnects 168.

The interconnect substrate 150 has an electrical connection section 170.The electrical connection section 170 may be a chip component(surface-mounting component, for example). The electrical connectionsection 170 may be provided at a location which is closer to theelectronic substrate 110 than the integrated circuit chip 152. Theelectrical connection section 170 may be provided to each of a pair ofregions located closer to each edge of the interconnect substrate 150than the center of the interconnect substrate 150 in the widthwisedirection.

FIG. 9 illustrates the electrical connection section 170 and itsneighboring configuration. One of the second interconnects 168 may beformed on an extension from one of the first interconnects 166 at aninterval from the end (end opposite to the second terminal 160) of thefirst interconnect 166. The second interconnects 168 may be formed inthe same number as the first interconnects 166.

The electrical connection section 170 electrically connects at least oneof the first interconnects 166 with at least one of the secondinterconnects 168. The electrical connection section 170 may include oneor more conductive sections 172. The conductive sections 172 may beelectrically insulated from one another. One conductive section 172 mayelectrically connect one of the first interconnects 166 with one of thesecond interconnects 168. One conductive section 172 may be disposed soto cross another conductive sections 172. This allows electricalconnection to be established between one of the first interconnects 166and one of the second interconnects 168 which is not located in theextension of the former. The conductive section 172 may include aresistor. The conductive section 172 be solder. The electricallyconnected first and second interconnects 166 and 168 make up a controlinterconnect.

The interconnect substrate 150 has two or more power supplyinterconnects 174 extending from two or more second terminals 162. Thepower supply interconnects 174 are formed extending through a pair ofregions located on both sides of the integrated circuit chip 152. If thepower supply interconnects 174 are formed extending through only oneside of the pair of regions located on both sides of the integratedcircuit chip 152, one group of the power supply interconnects 174becomes longer than the other group of the power supply interconnects174. In the present embodiment, since the difference in length betweenthe power supply interconnects 174 is small, current can be allowed toflow uniformly.

The interconnect substrate 150 has two or more signal interconnects 176which extend from two or more second terminals 164. The signalinterconnects 176 are formed in a region interposing between a pair ofregions in which the power supply interconnects 174 are formed. Theinterconnect substrate 150 includes a plurality of input interconnects178. The input interconnects 178 are connected with the integratedcircuit chip 152, and extend from the integrated circuit chip 152 in theopposite direction to where the signal interconnects 176 extend. Theinput interconnects 178 are used to input a data signal (digital signal,for example), a chip select signal, or source power to the integratedcircuit chip 152.

The interconnect substrate 150 has a plurality of connector terminals180. The connector terminals 180 are formed at an edge excluding theportion where the electronic substrate 110 is attached. The connectorterminals 180 are formed to be wider than the power supply interconnects174. The connector terminals 180 are connected with the power supplyinterconnects 174 and the input interconnects 178. The connectorterminals 180 are formed extending toward one side of the interconnectsubstrate 150.

The second terminals 160 connected with the first interconnects 166 maybe formed to have the same width as the second terminals 162 connectedwith the power supply interconnects 174, and to be wider than that ofthe second terminals 164 connected with the signal interconnects 176.The first and second interconnects 166 and 168 are formed in a pair ofregions which are located on both sides of a region in which the signalinterconnects 176 are formed and interpose between a pair of regions inwhich the power supply interconnects 174 are formed. A synchronizedclock signal may be output to each of the pair of regions located onboth sides of the region in which the signal interconnects 176 areformed from the integrated circuit chip 152 through the secondinterconnects 168. The signal interconnects 176 are formed to benarrower than the power supply interconnects 174. The second terminals164 with which the signal interconnects 176 are connected are formed tobe narrower than the second terminals 162 with which the power supplyinterconnects 174 are connected.

The second terminals 160, 162, and 164 are respectively electricallyconnected with the first terminals 120, 122, and 124 of the electronicsubstrate 110. The electrical connection may be achieved by using ananisotropic conductive material (anisotropic conductive film oranisotropic conductive paste, for example). In more detail, the secondterminals 160 connected with the first interconnects 166 areelectrically connected with the first terminals 120 connected with thecontrol interconnects 126. In other words, the first interconnects 166are electrically connected with the control interconnects 126. Thesecond terminals 162 connected with the power supply interconnect 174are electrically connected with the first terminals 122 connected withthe power supply interconnects 130, 132, 134, and 136. In other words,the power supply interconnect 174 is electrically connected with thepower supply interconnects 130, 132, 134, and 136. The second terminals164 connected with the signal interconnects 176 are electricallyconnected with the first terminals 124 connected with the signalinterconnects 138. In other words, the signal interconnects 176 areelectrically connected with the signal interconnects 138.

The interconnect substrate 150 has a second positioning mark 182 (seeFIG. 10). The electronic substrate 110 and the interconnect substrates150 can be positioned by aligning the second positioning mark 182 with afirst positioning mark 146.

FIG. 10 is a view illustrating a method of manufacturing theinterconnect substrate. FIG. 10 shows a state in which the interconnectsubstrate 150 is not provided with the integrated circuit chip 152 andthe electrical connection section 170. The interconnect substrate 150may be formed by punching a tape 184 as shown by a two-dot line in FIG.10. If holes 186 are formed in advance in the interconnect substrate 150and the tape 184 is punched based on the holes 186, an accurate punchingoperation can be performed. The holes 186 can be used to fix theinterconnect substrate 150. The interconnect substrate 150 thus fixedmay be attached to the electronic substrate 110.

One or more dummy patterns 188, 190, 192, and 194 are formed on theinterconnect substrate. Since the dummy patterns 188, 190, 192, and 194are formed, the area of the substrate 150 which is not covered withconductive foil is reduced, whereby warping or deformation of theinterconnect substrate 150 can be prevented. Each of the dummy patterns188 and 194 respectively has marks 196 and 198. The marks 196 and 198may be through holes formed in the dummy patterns 188 and 194, orthrough holes formed in the dummy patterns 188 and 194 and theinterconnect substrate 150, or through holes formed in a resin layer(resist layer, for example) on the dummy patterns 188 and 194. The marks196 and 198 enable positioning of the integrated circuit chip 152. Themarks 196 and 198 may be used to position the closest corner of theintegrated circuit chip 152. The dummy patterns 190 and 192 are formedin the shape of a stripe, and a plurality of openings are formed in thedummy patterns 190 and 192. Therefore, the dummy patterns 190 and 192have high adhesion to a resin layer (resist layer, for example) formedthereon, whereby the resin layer is rarely removed.

In the method of manufacturing the electronic module according to thepresent embodiment, the first terminals 120, 122, and 124 of theelectronic substrate 110 are electrically connected with the secondterminals 160, 162, and 164 of the interconnect substrate 150. At leastone of the two or more first interconnects 166 extending from the two ormore second terminals 160 is electrically connected with at least one ofthe two or more second interconnects 168 electrically insulated from thefirst interconnects 166 by means of the electrical connection section170.

According to the present embodiment, it is possible to change thetransmission paths of the interconnect pattern depending on which of thefirst interconnects 166 and second interconnects 168 are electricallyconnected by the electrical connection section 170. Therefore, even ifthe arrangement sequence of the first terminals 120 in the electronicsubstrate 110 is changed, it is possible to deal with the change bymerely changing the transmission paths by using the electricalconnection section 170.

For example, instead of forming the transmission paths as shown in FIG.11(A) by using the electrical connection section 170, anothertransmission path may be formed by using an electrical connectionsection 200 as shown in FIG. 11(B). Specifically, in FIG. 11(B),electrical connection between the first interconnects 166 and the secondinterconnects 168, which are located in the extension of the former, isestablished by the electrical connection section 200.

FIG. 12 is a view illustrating circuits of the electronic moduleaccording to the present embodiment. A plurality of scanning lines 90, aplurality of signal lines 92 which extend in the direction intersectingthe scanning lines 90, and a plurality of power supply lines 94 whichextend along the signal lines 92 are formed on an operating section 112.The power supply lines 94 are electrically connected with either of thepower supply interconnects 130, 132, or 134. A luminescent material 144which becomes a pixel is provided corresponding to each intersectingpoint of the scanning lines 90 and the signal lines 92. Current flowsfrom the power supply line 94 to an anode 140 through a channel of thedrive element 102, and flows to a cathode 142 through the luminescentmaterial 144. The luminescent material 144 emits light corresponding tothe amount of current that flows through the luminescent material 144.For other details, explanations of the circuits (see FIG. 5) in thefirst embodiment shall apply.

Third Embodiment

FIG. 13 illustrates an electronic module (EL module or liquid crystalmodule, for example) according to a third embodiment of the presentinvention. The electronic module has an electronic substrate 210. FIG.14 is a plan view of the electronic substrate, and FIG. 15 is across-sectional view of the electronic substrate. The electronicsubstrate 210 may be a display panel (EL panel or liquid crystal panel,for example). The electronic substrate 210 has a substrate 211. Thesubstrate 211 may be a glass substrate, a plastic substrate, or asilicon substrate. As shown in FIG. 15, in the case where light isextracted from the substrate 211, a light-transmitting substrate is usedas the substrate 211.

The electronic substrate 210 has an operating section 212. The operatingsection 212 is a section in which operations for displaying an image areperformed. In the present embodiment, the operating section 212 is an EL(organic EL, for example) section. The EL section emits light byutilizing an electroluminescence phenomenon. The EL section may be of acarrier injection type. The EL section may be driven by electriccurrent. In more detail, current flows through a luminescent material(organic material, for example) 236 (see FIG. 15).

A pair of scanning drivers 214 is formed on both sides of the operatingsection 212, respectively, on the electronic substrate 210. The scanningdriver 214 may be a chip component or a thin film circuit (circuitincluding TFTs) formed on the substrate 211.

The electronic substrate 210 has a plurality of anode interconnects 220,222, and 224. Each of the anode interconnects 220, 222, and 224 is aninterconnect for allowing current to flow through the operating section212. Each of the anode interconnects 220, 222, and 224 is formed to havea different width, and is suitable for allowing a different value ofcurrent to flow corresponding to the difference in luminous efficiencydue to the color (RGB) of the luminescent material 236 (see FIG. 15).The electronic substrate 210 has a cathode interconnect 226. The anodeinterconnects 220, 222, and 224 and the cathode interconnect 226 areformed in a pair of regions which are located on both sides of theoperating section 212. The cathode interconnect 226 is disposed on theouter side of the anode interconnects 220, 222, and 224. The cathodeinterconnect 226 is formed in the shape of the letter “C” so as to avoidthe edge on which an interconnect substrate 240 is attached.

The electronic substrate 210 has signal interconnects 228. The signalinterconnects 228 supply a drive signal to the operating section 212.The electronic substrate 210 has control interconnects 230. The controlinterconnects 230 are formed in a pair of regions which are located onboth sides of the signal interconnects 228 and interpose between firstand second regions in which one part and the other part of the anodeinterconnects 220, 222, and 224 and the cathode interconnects 226 areformed. The signal interconnects 228 are formed in a region interposingbetween a pair of regions in which the control interconnects 230 areformed. The signal interconnects 228 are formed in a region interposingbetween the first and second regions in which one part and the otherpart of the anode interconnects 220, 222, and 224 and the cathodeinterconnects 226 are formed. The signal interconnects 228 are formed tobe narrower than the control interconnects 230. The signal interconnects228 are formed to be narrower than the anode interconnects 220, 222, and224 and the cathode interconnect 226.

The anode interconnects 220, 222, and 224, the cathode interconnect 226,the signal interconnects 228, and the control interconnects 230 arearranged to extend toward one side of the electronic substrate 210. Theend of each interconnect is a terminal.

The anode interconnects 220, 222, and 224 are connected with a pluralityof anodes 232 (see FIG. 15). The cathode interconnect 226 is connectedwith a cathode 234 (see FIG. 15). The cathode 234 is formed to face theanodes 232. The luminescent material 236 is provided between each of theanodes 232 and the cathode 234. A hole transport layer may be formedbetween the anodes 232 and the luminescent material 236, and an electrontransport layer may be formed between the cathode 234 and theluminescent material 236.

A sealing section 238 may be optionally provided to the electronicsubstrate 210. The sealing section 238 is provided to cover the cathode234 to prevent entrance of moisture or oxygen. The sealing section 238may be formed of a glass substrate or a plastic substrate if lighttransmittance is required. The sealing section 238 may be formed of ametal or silicon if light transmittance is not required.

An electronic module has an interconnect substrate 240. The interconnectsubstrate 240 has a substrate 241. The substrate 241 may be a flexiblesubstrate. The interconnect substrate 240 (substrate 241) is attached tothe electronic substrate 210. The electrical connection between theelectronic substrate 210 and the interconnect substrate 240 may beachieved by using an anisotropic conductive material (anisotropicconductive film or anisotropic conductive paste, for example).

An integrated circuit chip 242 is mounted on the interconnect substrate240. The signal driver 96 having a function of generating a signalsupplied to the operating section 212 (see FIG. 17) may be formed in theintegrated circuit chip 242. The integrated circuit chip 242 may bebonded face down or electrically connected by tape automated bonding(TAB). The integrated circuit chip 242 is mounted at the center of theinterconnect substrate 240 in the widthwise direction.

The interconnect substrate 240 has input terminals 244. The inputterminals 244 are ends of an interconnect pattern (not shown). The inputterminals 244 are formed on the end of an interconnect substrate 240excluding the portion where the electronic substrate 210 is attached.The input terminals 244 are formed to be wider than the power supplyinterconnects 260, 262, 264, 266, and 268. The input terminals 244 maybe formed extending toward one side of the interconnect substrate 240.

An external power supply V₀ is input to the input terminals 244. Theexternal power supply V₀ may be a single power supply (voltage). Theintegrated circuit chip 242 may be driven by the external power supplyV₀. The interconnect substrate 240 has one or more of amplifier circuits250, 252, and 254. The amplifier circuits 250, 252, and 254 amplify(increase the voltage) the external power supply V₀ input to the inputterminals 244 to generate a plurality of different (in voltage)amplified power supplies V₁ to V₅. The amplifier circuits 250, 252, and254 are formed in the region interposing between the integrated circuitchip 242 and the input terminals 244. A pair of the amplifier circuits250 and 252 are formed on both end portions of the interconnectsubstrate 240, respectively, in the widthwise direction. In amodification example shown in FIG. 16, a pair of amplifier circuits 272and 274 are respectively formed in a pair of regions located on bothsides of the integrated circuit chip 242.

According to the present embodiment, since a plurality of differentamplified power supplies V₁ to V₅ are generated by amplifying theexternal power supply V₀, the electronic module can be driven merely byinputting a few types of external power supplies (single power supply,for example) V₀.

The amplifier circuits 250 and 252 are separately formed from theintegrated circuit chip 242. This makes it possible to prevent theintegrated circuit chip 242 from being influenced by the amplificationeffect by the amplifier circuits 250 and 252. This configuration may beapplied to the case where the amplifier circuits 250 and 252 cannot beincorporated into the integrated circuit chip 242 due to high currentvalues of the amplified power supplies V₁, V₂, and V₃.

The amplifier circuit 254 is made up of a first circuit 256 and a secondcircuit 258. The first circuit 256 is formed in the integrated circuitchip 242. The second circuit 258 is separately formed from theintegrated circuit chip 242. The second circuit 258 may include acapacitor or an inductor, and make up at least a part of a charge pumpcircuit. It is advantageous to separately form the second circuit 258from the integrated circuit chip 242 in the case where the secondcircuit 258 requires a number of parts.

The interconnect substrate 240 includes power supply interconnects 260,262, 264, 266, and 268. The power supply interconnects 260, 262, 264,266, and 268 extend from the amplifier circuits 250, 252, and 254 towardthe electronic substrate 210.

The amplifier circuit 250 is electrically connected with the powersupply interconnect 260. The power supply interconnect 260 iselectrically connected with the anode interconnect 224 of the electronicsubstrate 210. FIG. 13 shows the back surface of the electronicsubstrate 210 shown in FIG. 14. The external power supply V₀ input tothe amplifier circuit 250 is amplified to the amplified power supply V₁.The amplified power supply V₁ is input to the anode interconnect 224through the power supply interconnect 260. The amplifier circuit 252 iselectrically connected with the power supply interconnects 262 and 264.Each of the power supply interconnects 262 and 264 is electricallyconnected with the anode interconnects 220 and 222 of the electronicsubstrate 210. The external power supply V₀ input to the amplifiercircuit 252 is amplified to the amplified power supplies V₂ and V₃. Theamplified power supplies V₂ and V₃ are input to the anode interconnects220 and 222 through the power supply interconnects 262 and 264,respectively. The electronic substrate 210 is driven by the amplifiedpower supplies V₁, V₂, and V₃.

The power supply interconnects 260, 262 and 264 are formed extendingthrough a pair of regions located on both sides of the integratedcircuit chip 242. If the power supply interconnects 260, 262, and 264are formed extending through only one side of the pair of regionslocated on both sides of the integrated circuit chip 242, the powersupply interconnects 260 becomes longer than the power supplyinterconnects 262 and 264, for example. In the present embodiment, sincethe difference in length between the power supply interconnects 260, 262and 264 is small, current can be allowed to flow uniformly.

The amplifier circuit 254 is electrically connected with the powersupply interconnects 266 and 268. Each of the power supply interconnects266 and 268 is electrically connected with the control interconnects 230of the electronic substrate 210. The control interconnects 230 connectedwith the power supply interconnects 266 and 268 are used to supply powerto the scanning driver 214. The external power supply V₀ input to theamplifier circuit 254 is amplified to the amplified power supplies V₄and V₅. The amplified power supplies V₄ and V₅ are input to the controlinterconnects 230 through the power supply interconnects 266 and 268,respectively.

The interconnect substrate 240 has signal interconnects 270 extendingfrom the integrated circuit chip 242 to the electronic substrate 210.The signal interconnects 270 are formed in a region interposing betweenfirst and second regions in which one part and the other part of thepower supply interconnects 260, 262, 264, 266, and 268 are formed. Thesignal interconnects 270 are electrically connected with the signalinterconnect 228 of the electronic substrate 210. The power supplyinterconnects 260, 262, 264, 266, and 268 may be formed to be wider thanthe signal interconnects 270.

The interconnect substrate 240 has a control interconnects (interconnectfor supplying a signal such as a clock signal from the integratedcircuit chip 242 to the scanning driver 214), a cathode interconnect(interconnect electrically connected with the cathode interconnects226), an input interconnect (interconnect connected with the inputterminal 244), and the like (not shown).

In a method of driving the electronic module according to the presentembodiment, the external power supply V₀ is input to the input terminals244 formed on the interconnect substrate 240 on which the integratedcircuit chip 242 is mounted. A plurality of amplified power supplies V₁to V₅ are generated by amplifying the external power supply V₀ by usingone or more of the amplifier circuits 250, 252, and 254 formed on theinterconnect substrate 240. The electronic substrate 210 electricallyconnected with the interconnect substrate 240 is driven by the amplifiedpower supplies V₁ to V₅.

FIG. 17 is a circuit diagram illustrating circuits of the electronicmodule according to the present embodiment. A plurality of scanninglines 90, a plurality of signal lines 92 which extend in the directionintersecting the scanning lines 90, and a plurality of power supplylines 94 which extend along the signal lines 92 are formed in theoperating section 212. The power supply lines 94 are electricallyconnected with one of the anode interconnects 220, 222, and 224. Aluminescent material 236 which becomes a pixel is provided correspondingto each intersecting point of the scanning lines 90 and the signal lines92. Current flows from the power supply line 94 to an anode 232 througha channel of the drive element 102, and flows to a cathode 234 throughthe luminescent material 236. The luminescent material 236 emits lightcorresponding to the amount of current that flows through theluminescent material 236. For other details, explanations of thecircuits (see FIG. 5) in the first embodiment shall apply.

As an electronic instrument including the electronic module (EL moduleor liquid crystal module, for example) according to the embodiment ofthe present invention, FIG. 18 illustrates a notebook-type personalcomputer 1000, and FIG. 19 illustrates a portable telephone 2000.

The present invention is not limited to the above-described embodiments.Various modifications and variations are possible. For example, thepresent invention includes configurations essentially the same as theconfigurations described in the embodiments (for example, configurationshaving the same function, method, and results, or configurations havingthe same object and results). The present invention includesconfigurations in which any unessential part of the configurationdescribed in the embodiments is replaced. The present invention includesconfigurations having the same effects or achieving the same object asthe configurations described in the embodiments. The present inventionincludes configurations in which conventional technology is added to theconfigurations described in the embodiments.

1-13. (canceled)
 14. An electronic module comprising: an electronic substrate; and an interconnect substrate which is attached to the electronic substrate and on which an integrated circuit chip is mounted, wherein the interconnect substrate includes an input terminal and one or more amplifier circuits, each of the amplifier circuits generating a plurality of different amplified power supplies by amplifying an external power supply input to the input terminal.
 15. The electronic module as defined by claim 14, wherein the integrated circuit chip is driven by the external power supply, and wherein the electronic substrate is driven by the amplified power supplies.
 16. The electronic module as defined by claim 14, wherein the amplifier circuit is formed in a region between the integrated circuit chip and the input terminal.
 17. The electronic module as defined by claim 14, wherein the integrated circuit chip is mounted at a center of the interconnect substrate in a widthwise direction, and wherein a pair of the amplifier circuits are respectively formed on both end portions of the interconnect substrate in the widthwise direction.
 18. The electronic module as defined by claim 17, wherein the interconnect substrate includes: signal interconnects which extend from the integrated circuit chip toward the electronic substrate; and power supply interconnects which extend from the pair of amplifier circuits toward the electronic substrate, and wherein the power supply interconnects are formed to be wider than the signal interconnects.
 19. The electronic module as defined by claim 14, wherein one of the amplifier circuits includes a first circuit and a second circuit, the first circuit being formed on the integrated circuit chip, and a second circuit being provided separately from the integrated circuit chip.
 20. The electronic module as defined by claim 19, wherein the second circuit includes a capacitor.
 21. The electronic module as defined by claim 19, wherein the second circuit includes an inductor.
 22. An electronic instrument comprising the electronic module as defined by claim
 14. 23. A method of driving an electronic module comprising: inputting an external power supply to an input terminal formed on an interconnect substrate on which an integrated circuit chip is mounted; generating a plurality of different amplified power supplies by amplifying the external power supply by using one or more amplifier circuits formed on the interconnect substrate; and driving an electronic substrate electrically connected with the interconnect substrate by using the plurality of different amplified power supplies. 